RFIC & MMIC Design Powered by Cadence

Industry-leading schematic-driven RF/microwave design environment for MMIC, RFIC, and PCB designs up to mmWave frequencies.

• Harmonic Balance & Transient solvers
• MMIC/RFIC layout environment
• Integrated EM co-simulation
• PDK support for all major foundries

Complete RFIC design flow for GHz-range analogue and mixed-signal integrated circuits on CMOS, SiGe, and III-V processes.

• Schematic & layout editor
• AMS Designer co-simulation
• Constraint-driven layout
• DRC/LVS verification

Gold-standard RFIC simulator with Periodic Steady-State, Harmonic Balance, Envelope, and Noise analyses for RF circuit design.

• PSS, PAC, PNoise analyses
• Shooting Newton algorithm
• Monte Carlo & corner analysis
• Foundry-certified accuracy

High-capacity 3D planar EM simulator for full chip and package EM extraction — integrated directly into the Virtuoso/AWR flow.

• Full-wave 3D planar solver
• Chip, package, PCB support
• Layout-driven EM extraction
• MMIC passive component analysis

High-performance full-wave 3D finite-element EM solver for complex 3D structures including connectors, transitions, and packages.

• FEM-based full-wave solver
• Coupled EM-circuit simulation
• S-parameter extraction
• Antenna & aperture analysis

Unified design management and simulation orchestration for complex RFIC design projects with multiple corners and process variants.

• Multi-corner simulation
• Parametric sweeps
• Design plan management
• Result visualisation

Comprehensive PCB design suite for schematic capture, simulation, PCB layout, and signal integrity analysis — widely used for high-speed electronic system development.

• Schematic capture & PCB layout
• Signal integrity analysis
• Constraint-driven design
• Integrated simulation workflow

Enterprise-grade PCB design environment for complex electronic systems, enabling high-speed, HDI, RF, and multi-board development workflows.

• Advanced PCB routing
• High-speed design analysis
• Multi-board system integration
• RF & mixed-signal support

AI-driven electrothermal co-simulation platform for accurate thermal analysis and reliability optimisation across IC, package, and PCB designs.

• Electrothermal co-simulation
• Chip-package-board analysis
• AI-assisted thermal optimisation
• Reliability & hotspot prediction

High-fidelity computational fluid dynamics and advanced meshing solution for aerospace, defence, automotive, and electronics thermal simulations.

• Advanced CFD simulation
• High-quality mesh generation
• Aerospace & thermal analysis
• Scalable HPC workflows

Advanced CAE pre-processing, simulation, and post-processing platform recently acquired by Cadence for integrated engineering analysis workflows.

• Simulation model preparation
• Crash, NVH & durability analysis
• High-performance post-processing
• Integrated multiphysics workflows

Integrated design and engineering technologies from Hexagon AB’s D&E business, strengthening Cadence’s digital engineering and intelligent system design portfolio.

• Digital engineering workflows
• System-level modelling
• Manufacturing design integration
• Next-generation engineering analytics